Semiconductor memory device and method of operating the same

ABSTRACT

Provided herein may be a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a plurality of pages each including a plurality of memory cells, peripheral circuits configured to perform a program operation of a selected page among the plurality of pages and a control logic configured to control the peripheral circuits such that a main program operation is performed on the selected page and, when the main program operation is completed, a compensation program operation is performed on memory cells having lower threshold voltage retention characteristics compared to remaining memory cells, among the memory cells included in the selected page.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. § 119(a) toKorean patent application number 10-2016-0182696 filed on Dec. 29, 2016in the Korean Intellectual Property Office, the entire disclosure ofwhich is incorporated herein by reference.

BACKGROUND

1. Technical Field

Various embodiments of the present disclosure generally relate to asemiconductor memory device and a method of operating the same, and moreparticularly, to a program operation of the semiconductor memory device.

2. Related Art

Memory devices are classified into a volatile memory device and anonvolatile memory device.

The nonvolatile memory device may maintain data stored therein even whensupply of power is interrupted, although the read and write speeds ofthe nonvolatile memory device are relatively low compared to those ofthe volatile memory device. Therefore, the nonvolatile memory device iswidely used for portable electronic devices so as to store data thatmust be maintained regardless of supply of power.

According to a method of storing data, nonvolatile memory devices may beclassified into a read-only memory (ROM), a mask ROM (MROM), aprogrammable ROM (PROM), an erasable programmable ROM (EPROM), anelectrically erasable programmable ROM (EEPROM), a flash memory, aphase-change random access memory (PRAM), a magnetic RAM (MRAM), aresistive RAM (RRAM), a ferroelectric RAM (FRAM), etc.

Among the nonvolatile memory devices, the flash memory device may have atwo-dimensional structure in which cell strings are horizontallyarranged on a semiconductor substrate, or a three-dimensional structurein which cell strings are vertically arranged on a semiconductorsubstrate. The three-dimensional memory device is a device which isdevised to overcome a limitation in the degree of integration of thetwo-dimensional memory device and may include a plurality of memorycells which are vertically stacked on a semiconductor substrate.

SUMMARY

Various embodiments of the present disclosure are directed to asemiconductor memory device which has improved reliability in a programoperation and a method of operating the same.

An embodiment of the present disclosure may provide for a semiconductormemory device including: a plurality of pages each including a pluralityof memory cells; peripheral circuits configured to perform a programoperation on a selected page among the plurality of pages; and a controllogic configured to control the peripheral circuits such that a mainprogram operation is performed on the selected page and, when the mainprogram operation is completed, a compensation program operation isperformed on memory cells having lower threshold voltage retentioncharacteristics compared to remaining memory cells, among the memorycells included in the selected page.

An embodiment of the present disclosure may provide for a method ofoperating a semiconductor memory device including: performing a mainprogram operation on a selected page; and performing a compensationprogram operation on memory cells programmed to a most significantprogram state among memory cells included in the selected page, when themain program operation is completed.

An embodiment of the present disclosure may provide for a method ofoperating a semiconductor memory device including: inputting externaldata to first latches of page buffers; transmitting the external data tosecond latches and third latches of the page buffers; performing a mainprogram operation and a verify operation on a selected page using datatransmitted to the third latches; retransmitting data stored in thesecond latches to the third latches if the verify operation has passed;adjusting voltages of bit lines using the data retransmitted to thethird latches; and applying a compensation program voltage to a wordline coupled to the selected page.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a memory system in accordancewith an embodiment of the present disclosure.

FIG. 2 is a block diagram illustrating a memory device of FIG. 1.

FIG. 3 is a diagram illustrating a memory block of FIG. 2.

FIG. 4 is a perspective diagram illustrating an embodiment of a memoryblock having a three-dimensional structure.

FIG. 5 is a perspective diagram illustrating an embodiment of a memoryblock having a three-dimensional structure.

FIGS. 6 to 8 are diagrams illustrating program states of memory cells inaccordance with various embodiments.

FIG. 9 is a diagram illustrating a page buffer according to anembodiment of the present disclosure.

FIG. 10 is a flowchart illustrating a program operation according to anembodiment of the present disclosure.

FIG. 11 is a diagram illustrating voltages which are applied to wordlines and bit lines, during a program operation according to anembodiment of the present disclosure.

FIG. 12 is a diagram illustrating voltages which are applied to aselected word line, during a program operation according to anembodiment of the present disclosure.

FIG. 13 is a flowchart illustrating an embodiment of a compensationprogram operation of FIG. 10.

FIGS. 14 and 15 are diagrams illustrating a threshold voltagedistribution of memory cells, during a program operation according to anembodiment of the present disclosure.

FIG. 16 is a block diagram for describing an embodiment of a memorysystem including a semiconductor memory device shown in FIG. 2.

FIG. 17 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

FIG. 18 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

FIG. 19 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey a scope of example embodiments to those skilled in the art.

In the drawing figures, dimensions may be exaggerated for clarity ofillustration. It will be understood that when an element is referred toas being “between” two elements, it can be the only element between thetwo elements, or one or more intervening elements may also be present.

Hereinafter, embodiments will be described with reference to theaccompanying drawings. Embodiments are described herein with referenceto cross-sectional illustrations that are schematic illustrations ofembodiments (and intermediate structures). As such, variations from theshapes of the illustrations as a result, for example, of manufacturingtechniques and/or tolerances, are to be expected. Thus, embodimentsshould not be construed as limited to the particular shapes of regionsillustrated herein but may include deviations in shapes that result, forexample, from manufacturing. In the drawings, lengths and sizes oflayers and regions may be exaggerated for clarity. Like referencenumerals in the drawings denote like elements.

Terms such as ‘first’ and ‘second’ may be used to describe variouscomponents, but the terms should not limit the various components. Thoseterms are only used for the purpose of differentiating a component fromother components. For example, a first component may be referred to as asecond component, and a second component may be referred to as a firstcomponent and so forth without departing from the spirit and scope ofthe present disclosure. Furthermore, ‘and/or’ may include any one of ora combination of the components mentioned.

Furthermore, a singular form may include a plural from as long as it isnot specifically mentioned in a sentence. Furthermore,“include/comprise” or “including/comprising” used in the specificationrepresents that one or more components, steps, operations, and elementsexist or are added.

Furthermore, unless defined otherwise, all the terms used in thisspecification including technical and scientific terms have the samemeanings as would be generally understood by those skilled in therelated art. The terms defined in generally used dictionaries should beconstrued as having the same meanings as would be construed in thecontext of the related art, and unless clearly defined otherwise in thisspecification, should not be construed as having idealistic or overlyformal meanings.

It is also noted that in this specification, “connected/coupled” refersto one component not only directly coupling another component but alsoindirectly coupling another component through an intermediate component.On the other hand, “directly connected/directly coupled” refers to onecomponent directly coupling another component without an intermediatecomponent.

FIG. 1 is a diagram illustrating a memory system in accordance with anembodiment of the present disclosure.

Referring to FIG. 1, a memory system 1000 may include a semiconductormemory device 1100 which stores data, and a memory controller 1200 whichcontrols the semiconductor memory device 1100 under control of a host2000.

The host 2000 may communicate with the memory system 1100 using aninterface protocol such as a peripheral component interconnect-express(PCI-E), an advanced technology attachment (ATA), a serial ATA (SATA), aparallel ATA (PATA), or a serial attached SCSI (SAS). In addition, theinterface protocol provided for the purpose of data communicationbetween the host 2000 and the memory system 1000 may be an interfaceprotocol such as a Universal Serial Bus (USB), a Multi-Media Card (MMC),an Enhanced Small Disk Interface (ESDI), or Integrated Drive Electronics(IDE).

The memory controller 1200 may control overall operation of the memorysystem 1000 and data exchange between the host 2000 and thesemiconductor memory device 1100. For example, the memory controller1200 may control the semiconductor memory device 1100 to program or readdata in response to a request from the host 2000. In addition, thememory controller 1200 may store information of main memory blocks andsub-memory blocks that are included in the semiconductor memory device1100, and select the semiconductor memory device 1100 such that aprogram operation is performed on the main memory block or thesub-memory block according to the amount of data loaded for the programoperation. According to an embodiment, the semiconductor memory device1100 may include a double data rate synchronous dynamic random accessmemory (DDR SDRAM), a low power DDR SDRAM fourth generation (LPDDR4SDRAM), a graphics double data rate SDRAM (GDDR SDRAM), a low power DDR(LPDDR), a Rambus dynamic random access memory (RDRAM), or a flashmemory.

The semiconductor memory device 1100 may perform a program, read, orerase operation under control of the memory controller 1200. Forexample, the semiconductor memory device 1100 may program memory cellsincluded in a selected page. For example, if a program verify operationof a selected page has passed, the semiconductor memory device 1100 mayfurther perform a compensation program operation for improving retentioncharacteristics of memory cells programmed to have the highest thresholdvoltage. Here, the retention characteristics refer to characteristics inwhich threshold voltages of the memory cells may be retained.

FIG. 2 is a diagram illustrating the memory device of FIG. 1.

Referring to FIG. 2, the memory device 1110 may include a memory cellarray 100 configured to store data. The memory device 1110 may includeperipheral circuits 200 configured to perform a program operation forstoring data in the memory cell array 100, a read operation foroutputting the stored data, and an erase operation for erasing thestored data. The memory device 1110 may include a control logic 300configured to control the peripheral circuits 200 under control of thememory controller (1200 of FIG. 1).

The memory cell array 100 may include a plurality of memory blocks MB1to MBk (k is a positive integer). Local lines LL and bit lines BL1 toBLI (I is a positive integer) may be coupled to each of the memoryblocks MB1 to MBk. For example, the local lines LL may include wordlines, drain and source select lines. For example, the local lines LLmay include the word lines, the drain and source select lines, andsource lines. For example, the local lines LL may further include dummylines. For example, the local lines LL may further include pipe lines.

The local lines LL may be respectively coupled to the memory blocks MB1to MBk, and the bit lines BL1 to BLI may be coupled in common to thememory blocks MB1 to MBk. The memory blocks MB1 to MBk may be embodiedin a two-dimensional or three-dimensional structure.

The peripheral circuits 200 may be configured to perform program, read,and erase operations on a selected memory block under control of thecontrol logic 300. For example, the peripheral circuits 200 may includea voltage generation circuit 210, a row decoder 220, a page buffer group230, a column decoder 240, an input/output circuit 250, and a currentsensing circuit 260.

The voltage generation circuit 210 may generate various operatingvoltages Vop to be used for program, read, and erase operations inresponse to an operating signal OP_CMD. For example, the voltagegeneration circuit 210 may generate a program voltage, a verify voltage,a pass voltage, a compensation program voltage, a read voltage, an erasevoltage, a turn-on voltage, and so forth, under control of the controllogic 300. In one example, under control of the control logic 300, thevoltage generation circuit 210 may generate program voltages increasingin steps during a main program operation and a compensation programvoltage during a compensation program operation.

The row decoder 220 may deliver operating voltages Vop to the locallines LL coupled to a selected memory block in response to a row addressRADD.

The page buffer group 230 may include a plurality of page buffers PB1 toPBI coupled to the bit lines BL1 to BLI. The page buffers PB1 to PBI mayoperate in response to page buffer control signals PBSIGNALS. Forexample, the page buffers PB1 to PBI may temporarily store data receivedthrough the bit lines BL1 to BLI, or sense voltages or currents of thebit lines BL1 to BLI during a read or verify operation.

The column decoder 240 may transmit data between the input/outputcircuit 250 and the page buffer group 230 in response to a columnaddress CADD. For example, the column decoder 240 may exchange data withthe page buffers PB through data lines DL or exchange data with theinput/output circuit 250 through column lines CL.

The input/output circuit 250 may transmit a command CMD or an addressADD received from the memory controller (1200 of FIG. 1) to the controllogic 300, or exchange data DATA with the column decoder 240.

During the read or verify operation, the current sensing circuit 260 maygenerate a reference current in response to an enable bit VRY_BIT<#>,and may compare a sensing voltage VPB received from the page buffergroup 230 with a reference voltage generated by the reference current,and output a pass signal PASS or a fail signal FAIL.

The control logic 300 may output an operating signal OP_CMD, a rowaddress RADD, page buffer control signals PBSIGNALS, and an enable bitVRY_BIT<#> in response to a command CMD and an address ADD and thuscontrol the peripheral circuits 200. In addition, the control logic 300may determine whether a verify operation has passed or failed inresponse to a pass or fail signal PASS or FAIL. In particular, during aprogram operation, after a main program operation of a selected page hascompleted, the control logic 300 may control the peripheral circuits 200so that a compensation program operation of the selected page isperformed on memory cells having lower threshold voltage retentioncharacteristics than remaining memory cells. In one example, when themain program operation of the selected page has completed, the controllogic 200 reloads data DATA that was used during the main programoperation.

FIG. 3 is a diagram illustrating a memory block of FIG. 2.

Referring to FIG. 3, since the memory blocks MB1 to MBk have the same orsimilar configuration, a first memory block MB1 among the memory blocksMB1 to MBk will be described as an example.

The first memory block MB1 may include a plurality of cell strings STcoupled between the bit lines BL and a source line SL. For example, thecell strings ST may be respectively coupled to the bit lines BL, and becoupled in common to the source line SL. Since the cell strings ST havethe same or similar configuration, one cell string ST among them will bedescribed as an example.

The cell string ST may include a source select transistor SST, first ton-th memory cells F1 to Fn (n is a positive integer), and a drain selecttransistor DST which are coupled in series to each other between thesource line SL and a corresponding bit line BL. Because FIG. 3 showsonly one embodiment provided for the sake of understanding theconfiguration of the first memory block MB1, the number of source anddrain select transistors SST and DST and the number of first to n-thmemory cells F1 to Fn are not limited to those shown in FIG. 3. Thesource select transistor SST may be coupled between the source line SLand the first memory cell F1. The first to n-th memory cells F1 to Fnmay be coupled in series between the source select transistor SST andthe drain select transistor DST. The drain select transistor DST may becoupled between the n-th memory cell Fn and the bit line BL. Althoughnot shown, dummy cells may be further coupled between the memory cellsF1 to Fn, or between the source select transistor SST and the drainselect transistor DST.

Gates of the source select transistors SST included in different cellstrings ST may be coupled to the source select line SSL. Gates of thefirst to n-th memory cells F1 to Fn may be respectively coupled to firstto n-th word lines WL1 to WLn. Gates of the drain select transistors DSTmay be coupled to a drain select line DSL.

A group of memory cells coupled to the same word line refers to a pagePG. Each of program and read operations may be performed on a page basisin a selected memory block.

FIG. 4 is a perspective diagram illustrating an embodiment of a memoryblock having a three-dimensional structure.

Referring to FIG. 4, the memory block having a three-dimensionalstructure may include a plurality of cell strings ST formed in avertical direction (e.g., Z-direction) on a substrate and arrangedbetween the bit lines BL and the source lines SL. For example, the cellstrings ST may be formed in an I-shape. This structure may be called“Bit Cost Scalable” (BiCS). For example, in the case where the sourceline SL is horizontally formed on the substrate, the cell strings SThaving a BiCS structure may be formed vertically (e.g., in theZ-direction) on the source line SL.

In more detail, each of the cell strings ST may be arranged in a firstdirection (e.g., X-direction) and a second direction (e.g.,Y-direction). The cell strings ST may include may include source selectlines SSL, word lines WL, and drain select lines DSL, which are stackedto be spaced apart from each other. The number of source select linesSSL, the number of word lines WL, and the number of drain select linesDSL are not limited to those shown in FIG. 4 and may be changeddepending on the semiconductor memory device 1100. The cell strings STmay include vertical channel layers CH which vertically pass through thesource select lines SSL, the word lines WL, and the drain select linesDSL, and bit lines BL which come into contact with upper ends of thevertical channel layers CH protruding upward from the drain select linesDSL and extend in the second direction (Y-direction).

Memory cells may be formed between the word lines WL and the verticalchannel layers CH. Contact plugs CT may be further formed between thebit lines BL and the vertical channel layers CH.

FIG. 5 is a perspective diagram illustrating an embodiment of a memoryblock having a three-dimensional structure.

Referring to FIG. 5, the memory block having a three-dimensionalstructure may include source strings ST_S and drain strings ST_D, eachof which may be formed in a vertical direction (e.g., Z-direction) on asubstrate, and which are coupled to each other between the bit lines BLand the source lines SL. In an embodiment, each source string ST_S andthe corresponding drain string ST_D may be coupled to each other througha pipe gate PG to form a U shape. The pipe gate PG may be formed in apipe line PL. In more detail, the source strings ST_S may be verticallyarranged between the source lines SL and the pipe line PL. The drainstrings ST_D may be vertically arranged between the bit lines BL and thepipe line PL. This structure may be called “Pipe-shaped Bit CostScalable” (P-BiCS).

In more detail, the drain strings ST_D and the source strings ST_S maybe arranged in the first direction (e.g., X-direction) and the seconddirection (e.g., Y-direction). The drain strings ST_D and the sourcestrings ST_S may be alternately arranged in the second direction(Y). Thedrain strings ST_D may include word lines WL and drain select lines DSLwhich are spaced apart from each other, and drain vertical channellayers D_CH which vertically pass through the word lines WL and thedrain select lines DSL. The source strings ST_S may include word linesWL and source select lines SSL which are spaced apart from each other,and source vertical channel layers S_CH which vertically pass throughthe word lines WL and the source select lines SSL. The drain verticalchannels D_CH and the source vertical channels S_CH may be coupled toeach other by pipe gates PG in the pipe line PL. The bit lines BL maycome into contact with upper ends of the drain vertical channel layersD_CH, where the upper ends of the drain vertical channel layers D_CHprotrude upward from the drain select lines DSL. The bit lines BL mayextend in the second direction (e.g., Y direction).

FIGS. 6 to 8 are diagrams illustrating program states of memory cells inaccordance with various embodiments. FIG. 6 is a diagram illustrating aprogram state of a single level cell (SLC). FIG. 7 is a diagramillustrating a program state of a multi-level cell (MLC). FIG. 8 is adiagram illustrating a program state of a triple level cell (TLC).

Referring to FIG. 6, the single level cell (SLC) refers to a manner inwhich memory cells are programmed to have an erase state E or oneprogram state P. For example, in the SLC manner, each of the memorycells may have data ‘1’ corresponding to the erase state E or data ‘0’corresponding to the program state.

Referring to FIG. 7, the multi-level cell (MLC) refers to a manner inwhich memory cells are programmed to have an erase state E or threeprogram states P1 to P3. For example, in the MLC manner, each of thememory cells may have data ‘11’ corresponding to the erase state E orany one of data ‘10’, ‘01’, and ‘00’ which respectively correspond tofirst to third program states.

Referring to FIG. 8, the triple level cell (TLC) refers to a manner inwhich memory cells are programmed to have an erase state E or sevenprogram states P1 to P7. For example, in the triple level cell (TLC)manner, each of the memory cells may have data ‘111’ corresponding tothe erase state E or any one of data ‘110’, ‘100’, ‘000’, ‘010’, ‘011’,‘001’ and ‘101’ which respectively correspond to first to seventhprogram states.

In a nonvolatile memory device, because data programmed in memory cellsmust be retained for a long period of time, the nonvolatile memorydevice must have excellent retention characteristics. However, in thecase of the multi-level cell (MLC) or the triple level cell (TLC), adifference in threshold voltages of the programmed memory cells isrelatively large. In this case, the probability of a change in theretention characteristics is increased. For example, with regard to thetriple level cell (TLC), because memory cells programmed to the seventhprogram state P7 have the highest threshold voltage, the possibility inwhich the threshold voltage of the memory cells programmed to theseventh program state P7 lowers is higher than that of memory cellsprogrammed to first to sixth program states P1 to P6. That is, thememory cells programmed to the seventh program state P7 may haveinferior retention characteristics, compared to that of the other memorycells. As in a quadruple level cell besides the above-describedmulti-level cell MLC or triple level cell TLC, the more program states,the more inferior the retention characteristics.

To improve the reliability of memory cells having inferior retentioncharacteristics, in an embodiment, a compensation program operation maybe further performed after a main program operation has completed.

FIG. 9 is a diagram illustrating a page buffer according to anembodiment of the present disclosure.

Referring to FIG. 9, because the page buffers (PB1 to PBI of FIG. 2)have the same or similar configuration, only the first page buffer PB1among them will be described as an example.

The first page buffer PB1 may be coupled between a first bit line BL1and a data line DL. The first page buffer PB1 may include a plurality oflatches LAT1 to LATk (k is a positive integer) for temporarily storingdata inputted from an external device, for example the memory controller1200, or data read from memory cells. For example, the first page bufferPB1 may include first to k-th latches LAT1 to LATk. The first to k-thlatches LAT1 to LATk may have the same or similar configuration. Forexample, the first to k-th latches LAT1 to LATk may include inverters.Each latch may include two inverters which are coupled in series to eachother. For example, the first latch LAT1 may include two inverters. Anoutput terminal of one inverter may be coupled with an input terminal ofthe other inverter. That is, two inverters included in the first latchLAT1 may be coupled in series to each other between a main node and aninverting node. In the first latch LAT1, a first node Q1 may be a mainnode, and the other node Q1 b may be an inverting node. Therefore, thefirst to k-th latches LAT1 to LATk may respectively temporarily storedata to main nodes Q1 to Qk. For example, if data ‘0’ is inputted to thefirst node Q1 of the first latch LAT1, data ‘1’ corresponding toinverted data of the first node Q1 may be inputted to the inverting nodeQ1 b. The first to k-th latches LAT1 to LATk may be coupled to eachother, and exchange data with each other. Some of the first to k-thlatches LAT1 to LATk may be coupled to the data line DL, and the othersmay be coupled to the first bit line BL1. For example, the first latchLAT1 may be coupled to the data line DL, and the third latch LAT3 may becoupled to the first bit line BL1. The second latch LAT2 may temporarilystore data inputted to the first latch LAT1 before the data inputted tothe first latch LAT1 is transmitted to the third latch LAT3.

For example, with regard to a program operation, if all pieces oflogical data of a selected page are programmed, logical data of asubsequent page may also be programmed. For example, in the case of aprogram operation using the TLC manner, because three pieces of logicaldata may be programmed in one memory cell, a program operation on aselected page may be performed while increasing a program voltage insteps until all program operations for three logical data are completed.During a program operation, a program voltage may be applied to aselected word line, and a pass voltage may be applied to the other wordlines.

The program operation may be performed in an incremental step pulseprogram (ISPP) manner in which the program voltage is increased insteps. For example, data (0 or 1) transmitted from the external devicethrough the data line DL may be inputted to the first latch LAT1. Thedata inputted to the first latch LAT1 may be temporarily stored in thesecond latch LAT2 and then transmitted to the third latch LAT3 when, inone example, the main program operation is completed. For example, whenfirst logical data of a first page is inputted to the first latch LAT1,the first logical data may be successively transmitted to the first tothird latches LAT1 to LAT3. When the first logical data is transmittedto the third latch LAT3, data for a following program operation may beinputted to the first latch LAT. For example, when the first logicaldata is inputted to the second and third latches LAT2 and LAT3, secondlogical data of the first page may be inputted to the first latch LAT1.While program and verify operations for the first logical data areperformed, the first logical data inputted to the second latch LAT2 maybe retained. For instance, as a result of the verify operation for thefirst logical data, when it is determined that the program operation forthe first logical data has been completed, the second logical datainputted to the first latch LAT1 may be successively transmitted to thesecond and third latches LAT2 and LAT3, and program and verifyoperations for the second logical data may be performed. In other words,data stored in the second latch LAT2 may be retransmitted to the thirdlatch LAT3 if the verify operation has passed, and voltage of the bitline BL may be adjusted using the data retransmitted to the third latchLAT3. Although a program operation for last logical data of a selectedpage has completed, the last logical data of the selected page may beretained in the second latch LAT2.

FIG. 10 is a flowchart illustrating a program operation according to anembodiment of the present disclosure.

Referring to FIG. 10, when a program command is received at the controllogic (300 of FIG. 2), the control logic 300 may set a program voltageand a compensation program voltage for a program operation of a selectedpage, at S100. For example, the program voltage may be a voltage usedfor a main program operation, and the compensation program voltage maybe a voltage used for a compensation program operation. For instance, astart program voltage and a step voltage may be set as a program voltageto be used for a main program operation. The start program voltage maybe a voltage which is first applied to a selected word line in an ISPPprogram operation. The step voltage may be a level by which the programvoltage increases every time a program loop is performed. For example,while the program loop is performed, the program voltage may increase bystep voltages from the start program voltage. The compensation programvoltage may be set to a positive voltage equal to or lower than thehighest program voltage among program voltages used for program loops.

When voltages to be used for the program operation are set, at S100, thecontrol logic 300 may control the peripheral circuits (200 of FIG. 2)such that the main program operation of the selected page is performed,at S110. For example, the main program operation S110 may include a mainprogram step S111, a verify operation performing step S112, and aprogram voltage increasing step S113.

At the main program step S111, the program voltage may be applied to aselected word line to increase threshold voltages of selected memorycells of the selected page. At the verify operation performing stepS112, it may be determined whether the threshold voltages of theselected memory cells of the selected page have been increased to atarget voltage. When the threshold voltages of the selected memory cellsare lower than the target voltage, it may be determined that the verifyoperation has failed. When all of the threshold voltages of the selectedmemory cells are equal to or higher than the target voltage, it may bedetermined that the verify operation has passed. The main program stepS111 and the verify operation performing step S112 may form one programloop.

If it is determined that the verify operation has failed, the controllogic 300 may control the peripheral circuits 200 such that the programvoltage is increased by the step voltage, at S113. For example, thecontrol logic 300 may control the peripheral circuits 200 such thatsteps S111 to S113 are repeated until the threshold voltages of theselected memory cells of the selected page are equal to or higher thanthe target voltage.

If it is determined that the verify operation has passed, the controllogic 300 may control the peripheral circuit 200 such that thecompensation program operation of the selected page is performed, atS120. For example, the compensation program operation may be performedon some memory cells to improve retention characteristics of the memorycells that are inferior to the other memory cells, among the memorycells included in the selected page. For instance, the compensationprogram operation may be performed for memory cells programmed to thehighest program state, among the memory cells included in the selectedpage. In an embodiment, the compensation program operation may beperformed by applying a compensation program voltage to a word linecoupled to a selected page. In one example, the control logic 300 maycontrol the peripheral circuits 200 such that a compensation programvoltage is applied to a word line coupled to a selected page. Targetmemory cells on which the compensation program operation is to beperformed may be selected depending on external data which is last usedduring the program operation on the selected page. For example, aprogram enable voltage (e.g., 0V) or a program inhibit voltage (e.g.,supply voltage) may be applied to bit lines depending on the externaldata that is last used. In one example, the control logic 300 may adjustvoltages of the bit lines coupled to the selected page depending on theloaded data.

The compensation program operation may be performed on each page. Forexample, because a column of target cells on which the compensationprogram operation is to be performed may be changed in each page, thecompensation program operation may be performed every time a mainprogram operation of each page is completed.

The compensation program operation will be described in detail below.

FIG. 11 is a diagram illustrating voltages which are applied to wordlines and bit lines, during a program operation according to anembodiment of the present disclosure.

Referring to FIG. 11, voltages of bit lines may be adjusted depending onexternal data inputted to page buffers, during a program operation. Forexample, if data ‘0’ is inputted to the first page buffer coupled withthe first bit line BL1, a program enable voltage (e.g., 0V) may beapplied to the first bit line BL1. For example, if data ‘1’ is inputtedto the first page buffer coupled with the first bit line BL1, a programinhibit voltage (e.g., supply voltage) may be applied to the first bitline BL1. A main program operation and a compensation program operationwill be illustrated by way of example. After the first bit line BL1 isprecharged to a positive voltage, the first bit line BL1 may bemaintained in a precharge state (data ‘1’) or discharged (data ‘0’)depending on external data inputted to the first page buffer.Subsequently, after a pass voltage Vpass has been applied to the wordlines, a program voltage Vpgm or a compensation program voltage may beapplied to a selected word line.

FIG. 12 is a diagram illustrating a voltage which is applied to aselected word line during a program operation according to an embodimentof the present disclosure.

Referring to FIGS. 11 and 12, a program voltage Vpgm or a verify voltageVf may be applied to a selected word line in the main program operation(S110 of FIG. 10), and a compensation program voltage Vpgm_c may beapplied to the selected word line in the compensation program operation(S120 of FIG. 10). Because the main program operation S110 may beperformed in the ISPP manner, the program voltage Vpgm may be increasedin steps until the verify operation passes. The control logic 300 maycontrol peripheral circuits 200 to perform the compensation programoperation S120 by applying only the compensation program voltage Vpgm_cto the selected word line without a verify operation.

FIG. 13 is a flowchart illustrating an embodiment of the compensationprogram operation of FIG. 10.

The compensation program operation (S120 of FIG. 10) will be describedin detail with reference to FIG. 13. The compensation program operationS120 may include an operation S121 of loading data of a target cell onwhich the compensation program and a compensation program voltage applyoperation S122 is to be performed.

The target cell data loading operation S121 may be performed byreloading external data which is last used in a selected page of pagebuffers. For example, a selected page may be programmed using aplurality of logical data. There will be described an example of aprogram operation which is performed in the TLC manner.

TABLE 1 Status PV7 LAT1 1 LAT2 0 LAT3 1

In the TLC program operation, statuses of memory cells may be dividedinto an erase state and first to seventh program states. The erase staterefers to a state in which the threshold voltage is lowest. The firstprogram state refers to a state in which the threshold voltage is lowestamong the threshold voltages of the program states where the programstates are higher than the erase state. The threshold voltage isgradually increased from the first program state toward the seventhprogram state. In ‘Table 1’, the term ‘PV7’ refers to the seventhprogram state.

Depending on logical data inputted from the external device, each ofselected memory cells of a selected page may be maintained in the erasestate or be programmed to any one of the first to seventh programstates. Among the selected memory cells, memory cells programmed to theseventh program state PV7 have the most inferior retentioncharacteristics because the threshold voltage of these memory cells ishighest. Therefore, if a main program operation on the memory cells tobe programmed to the first to seventh program states has completed, acompensation program operation may be selectively performed only on thememory cells programmed to the seventh program state PV7. For example,during the main program operation on memory cells to be programmed tothe seventh program state PV7, data ‘0’ may be inputted to only pagebuffers corresponding to a column of the memory cells to be programmedto the seventh program state PV7, and data ‘1’ may be inputted to theother page buffers. Here, the term ‘data’ refers to data inputted to alatch that is coupled with the bit lines among a plurality of latchesLAT1 to LAT3 included in the page buffers. Data stored in the thirdlatch LAT3 may be changed depending on the result of a verify operationperformed during the main program operation. For example, if a verifyoperation on memory cells to be programmed to the seventh program statePV7 has passed, data of latches coupled to the corresponding memorycells are all changed to ‘1’. However, the original data is retained inother latches included in each page buffer. For example, when the mainprogram operation corresponding to the seventh program state PV7 hascompleted, there are no more operations to be performed. Thus, theexternal data for the program operation corresponding to the seventhprogram state PV7 may be retained in latches of each page buffer.Therefore, the compensation program operation may be performed bytransmitting the original data retained in the page buffers to latchescoupled to respective bit lines, and adjusting voltages of the bit linesdepending on data transmitted to the bit lines.

During the compensation program operation, the compensation programvoltage Vpgm_c applied to a selected word line may be a positive voltageequal to or lower than the highest voltage among the program voltagesVpgm used in the main program operation.

FIGS. 14 and 15 are diagrams illustrating a threshold voltagedistribution of memory cells, during a program operation according to anembodiment of the present disclosure.

Referring to FIG. 14, during a TLC program operation, when acompensation program operation is performed as described above, thethreshold voltage of memory cells programmed to the seventh programstate PV7 may be increased. For example, because the compensationprogram operation is selectively performed only on the memory cellsprogrammed to the seventh program state PV7, threshold voltages ofmemory cells programmed to the first to sixth program states PV1 to PV6may be maintained in a threshold voltage distribution formed when a mainprogram operation is completed. In other words, memory cells programmedto the most significant program state are set to memory cells programmedto a highest program state in the main program operation. That is, in anembodiment, the threshold voltage of the memory cells programmed to theseventh program state PV7 having inferior retention characteristics areselectively increased. Thus, although the threshold voltage of thememory cells programmed to the seventh program state PV7 is reducedafter the program operation has completed, a phenomenon in which even aread voltage is reduced may be prevented.

Referring to FIG. 15, the above-described compensation program operationmay also be performed in an MLC program operation. Because the thirdprogram state PV3 is the highest program state in the MLC programoperation, the compensation program operation may be selectivelyperformed only on memory cells programmed to the third program statePV3. The threshold voltages of only the memory cells programmed to thethird program state PV3 may be increased by the compensation programoperation.

The above-described compensation program operation may be applied to anoperation, such as a QLC program operation, in which pieces of logicaldata are programmed in one memory cell, as well as to the MLC and TLCprogram operations.

FIG. 16 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

Referring to FIG. 16, a memory system 30000 may be embodied in acellular phone, a smartphone, a tablet PC, a personal digital assistant(PDA), or a wireless communication device. The memory system 30000 mayinclude the semiconductor memory device 1100 and the memory controller1200 capable of controlling operation of the semiconductor memory device1100. The memory controller 1200 may control, under the control of aprocessor 3100, a data access operation, e.g., a program operation, anerase operation or a read operation, of the semiconductor memory device1100.

Data programmed in the semiconductor memory device 1100 may be outputtedthrough a display 3200 under control of the memory controller 1200.

A radio transceiver 3300 may exchange a wireless signal through anantenna ANT. For example, the radio transceiver 3300 may change awireless signal received through the antenna ANT into a signal which maybe processed in the processor 3100. Therefore, the processor 3100 mayprocess a signal outputted from the radio transceiver 3300 and transmitthe processed signal to the memory controller 1200 or the display 3200.The memory controller 1200 may program a signal processed by theprocessor 3100 to the semiconductor memory device 1100. Furthermore, theradio transceiver 3300 may change a signal outputted from the processor3100 into a wireless signal, and output the changed wireless signal tothe external device through the antenna ANT. An input device 3400 is adevice which may be used to input a control signal for controllingoperation of the processor 3100 or data to be processed by the processor3100. The input device 3400 may be embodied by a pointing device such asa touch pad and a computer mouse, a keypad or a keyboard. The processor3100 may control operation of the display 3200 such that data outputtedfrom the memory controller 1200, data outputted from the radiotransceiver 3300, or data outputted form the input device 3400 isoutputted through the display 3200.

According to an embodiment, the memory controller 1200 capable ofcontrolling the operation of the semiconductor memory device 1100 may beembodied as a part of the processor 3100 or a chip provided separatelyfrom the processor 3100.

FIG. 17 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

Referring to FIG. 17, the memory system 40000 may be embodied in apersonal computer, a tablet PC, a net-book, an e-reader, a personaldigital assistant (PDA), a portable multimedia player (PMP), an MP3player, or an MP4 player.

The memory system 40000 may include the semiconductor memory device 1100and the memory controller 1200 capable of controlling the dataprocessing operation of the semiconductor memory device 1100.

A processor 4100 may output data stored in the semiconductor memorydevice 1100 through a display 4300, depending on data inputted from aninput device 4200. For example, the input device 4200 may be embodied bya point device such as a touch pad or a computer mouse, a keypad or akeyboard.

The processor 4100 may control the overall operation of the memorysystem 40000 and control the operation of the memory controller 1200.According to an embodiment, the memory controller 1200 capable ofcontrolling the operation of the semiconductor memory device 1100 may beembodied as a part of the processor 4100 or a chip provided separatelyfrom the processor 4100.

FIG. 18 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

Referring to FIG. 18, a memory system 50000 may be embodied in an imageprocessing device, e.g., a digital camera, a portable phone providedwith a digital camera, a smartphone provided with a digital camera, or atablet PC provided with a digital camera.

The memory system 50000 may include the semiconductor memory device 1100and the memory controller 1200 capable of controlling a data processingoperation, e.g., a program operation, an erase operation or a readoperation, of the semiconductor memory device 1100.

An image sensor 5200 of the memory system 50000 may convert an opticalimage into digital signals. The converted digital signals may betransmitted to a processor 5100 or the memory controller 1200. Undercontrol of the processor 5100, the converted digital signals may beoutputted through a display 5300 or stored in the semiconductor memorydevice 1100 through the memory controller 1200. Furthermore, data storedin the semiconductor memory device 1100 may be outputted through thedisplay 5300 under control of the processor 5100 or the memorycontroller 1200.

According to an embodiment, the memory controller 1200 capable ofcontrolling operation of the semiconductor memory device 1100 may beembodied as a part of the processor 5100, or a chip provided separatelyfrom the processor 5100.

FIG. 19 is a block diagram for describing an embodiment of a memorysystem including the semiconductor memory device shown in FIG. 2.

Referring to FIG. 19, a memory system 70000 may be embodied in a memorycard or a smart card. The memory system 70000 may include thesemiconductor memory device 1100, the memory controller 1200, and a cardinterface 7100.

The memory controller 1200 may control data exchange between thesemiconductor memory device 1100 and the card interface 7100. Accordingto an embodiment, the card interface 7100 may be a secure digital (SD)card interface or a multi-media card (MMC) interface, but it is notlimited thereto.

The card interface 7100 may interface data exchange between a host 60000and the memory controller 1200 depending on a protocol of the host60000. The card interface 7100 according to an embodiment may support auniversal serial bus (USB) protocol, and an Interchip (IC)-USB protocol.Here, the card interface may refer to hardware capable of supporting aprotocol which is used by the host 60000, software installed in thehardware, or a signal transmission method.

When the memory system 70000 is connected to a host interface 6200 ofthe host 60000 such as a PC, a tablet PC, a digital camera, a digitalaudio player, a cellular phone, console video game hardware, or adigital set-top box, the host interface 6200 may perform datacommunication with the semiconductor memory device 1100 through the cardinterface 7100 and the memory controller 1200 under control of amicroprocessor 6100.

The present disclosure may improve the reliability of a programoperation of a semiconductor memory device and retention characteristicsof the semiconductor memory device.

Examples of embodiments have been disclosed herein, and althoughspecific terms are employed, they are used and are to be interpreted ina generic and descriptive sense only and not for purposes of limitation.In some instances, as would be apparent to one of ordinary skill in theart as of the filing of the present application, features,characteristics, and/or elements described in connection with aparticular embodiment may be used singly or in combination withfeatures, characteristics, and/or elements described in connection withother embodiments unless otherwise specifically indicated. Accordingly,it will be understood by those of skill in the art that various changesin form and details may be made without departing from the spirit andscope of the present disclosure as set forth in the following claims.

What is claimed is:
 1. A semiconductor memory device comprising: aplurality of pages each comprising a plurality of memory cells;peripheral circuits configured to perform a program operation on aselected page among the plurality of pages; and a control logicconfigured to control the peripheral circuits such that a main programoperation is performed on the selected page, and a compensation programvoltage is applied to a word line coupled to the selected page tocompensate threshold voltages of memory cells to be programmed to ahighest program state after the main program operation is completed,wherein the compensation program voltage is a positive voltage lowerthan a highest program voltage among program voltages used in the mainprogram operation.
 2. The semiconductor memory device according to claim1, wherein the peripheral circuits comprise: page buffers each includinga plurality of latches configured to temporarily store data during themain program operation and apply the compensation program voltage, undercontrol of the control logic; and a voltage generation circuitconfigured to generate the program voltages increasing in steps duringthe main program operation and the compensation program voltage when themain program operation is completed, under the control of the controllogic.
 3. The semiconductor memory device according to claim 2, whereinthe page buffers comprise: first latches configured to store datainputted from an external device; second latches configured to retainthe data inputted from the external device when the main programoperation is performed; and third latches configured to temporarilystore data to be used during the main program operation or apply thecompensation program voltage.
 4. The semiconductor memory deviceaccording to claim 3, wherein the data stored in the third latches ischanged depending on a result of a verify operation performed during themain program operation, and wherein the data stored in the secondlatches is transmitted to the third latches when the main programoperation is completed.
 5. The semiconductor memory device according toclaim 1, wherein the control logic controls the peripheral circuits suchthat the main program operation is performed in an incremental steppulse program (ISPP) manner, and when the main program operation iscompleted, the compensation program voltage is applied to the word linecoupled to the selected page.
 6. The semiconductor memory deviceaccording to claim 1, wherein the control logic controls the peripheralcircuits such that the compensation program voltage is applied to theword line coupled to the selected page without a verify operation. 7.The semiconductor memory device according to claim 1, wherein, when themain program operation of the selected page is completed, the controllogic reloads data that is last used during the main program operation,wherein the control logic adjusts voltages of bit lines coupled to theselected page depending on the loaded data, and wherein the controllogic controls the peripheral circuits such that the compensationprogram voltage is applied to the word line coupled to the selectedpage.
 8. A method of operating a semiconductor memory device,comprising: performing a main program operation on a selected page,wherein the main program operation includes a plurality of program loopscomprising applying a program voltage to a word line coupled to theselected page and performing a verify operation of the selected page;and performing a compensation program operation on memory cellsprogrammed to a most significant program state among memory cellsincluded in the selected page, when the verify operation passes and themain program operation is completed, wherein the compensation programoperation is performed by applying a compensation program voltage to theword line, and wherein the compensation program voltage is a positivevoltage lower than a highest program voltage which is used when theverify operation passes.
 9. The method according to claim 8, wherein themain program operation is performed in an incremental step pulse program(ISPP) manner.
 10. The method according to claim 9, wherein the mainprogram operation is repeated while increasing a program voltage insteps until all pieces of logical data are programmed to the selectedpage.
 11. The method according to claim 8, wherein the memory cellsprogrammed to the most significant program state are set to memory cellsprogrammed to a highest program state in the main program operation. 12.The method according to claim 11, wherein the memory cells that areprogrammed to the highest program state in the main program operationare selected depending on logical data that is last used in the mainprogram operation.
 13. A method of operating a semiconductor memorydevice, comprising: inputting external data to first latches of pagebuffers; transmitting the external data to second latches and thirdlatches of the page buffers; performing a main program operation and averify operation on a selected page using data transmitted to the thirdlatches; retransmitting data stored in the second latches to the thirdlatches if the verify operation has passed; adjusting voltages of bitlines using the data retransmitted to the third latches; and applying acompensation program voltage to a word line coupled to the selectedpage.
 14. The method according to claim 13, further comprising, afterthe transmitting of the external data to the second latches and thethird latches of the page buffers, inputting external data to beprogrammed to a subsequent page to the first latches.
 15. The methodaccording to claim 13, wherein the data transmitted to the secondlatches is retained while the main program operation and the verifyoperation are performed.
 16. The method according to claim 13, whereinthe compensation program voltage is set to a positive voltage equal toor lower than a highest voltage of program voltages used in the mainprogram operation.
 17. The method according to claim 13, furthercomprising, after the applying of the compensation program voltage tothe word line coupled to the selected page, performing the inputting,the transmitting, the performing, the retransmitting, the adjusting, andthe applying on a subsequent page.